Millimeter-Wave Chip Testing Solutions

The solution is designed for automated material handling, positioning, location calibration, and electrical‑parameter testing following the packaging of millimeter‑wave AIP chips, short‑range communication chips, and radar chips. It integrates with test fixtures, test instruments, and tape‑and‑reel machines, and leverages ATE platform software to enable test‑data feedback, material sorting, and automated tape‑and‑reel operations. Additionally, the system features self‑learning capabilities, allowing rapid compatibility and scalability across multiple device models, making it well suited for high‑volume production, screening and qualification, as well as R&D and testing applications.

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Scheme Overview

Millimeter-Wave Chip Sorting and Testing Solution

The solution is designed for automated material retrieval, positioning, positional calibration, and electrical‑parameter testing following the packaging of millimeter‑wave AIP chips, short‑range communication chips, and radar chips. It integrates with test fixtures, test instruments, and tape‑and‑reel machines, and leverages ATE platform software to enable test‑data feedback, material sorting, and automated tape‑and‑reel operations. Additionally, the system features self‑learning capabilities, allowing rapid compatibility and scalability across multiple device models, making it well suited for high‑volume production, screening and qualification, as well as R&D and testing applications.

The system primarily comprises a handler, a socket, a loadboard, and a test instrument. Our company is capable of delivering a complete millimeter-wave test solution based on standard instruments.

Application scenarios

Multi-channel Phased-Array TR Sorting Test

Short-Range Millimeter-Wave Chip Sorting and Testing

Millimeter-wave radar chip sorting and testing

Millimeter-Wave RF Front-End Sorting Test

Scheme Features

Strong device compatibility

Supports quick switching among multiple products;
Supports testing under a variety of environmental conditions, including low, ambient, and high temperatures.
Supports tray-based material collection and is also compatible with tape-and-reel packaging.

Modular structure

The loading/unloading module is designed to conform to the standard tray’s external dimensions, with provision made for a CCD vision module.
Standardized definition of the loadboard mounting position, enabling modular interchangeability across multiple product variants.
The tape‑winding machine is designed as an independent module, allowing for expansion or reduction based on customer requirements.

The equipment is highly reliable.

Material loss rate: <1/10,000;
Test station contact failure rate: <1/10,000;
MTBF (Mean Time Between Failures) ≥ 220 hours;
MTBA (Mean Time Between Alarms) ≥ 120 min.

Software platformization

It features a visual, concise, and intuitive display and operation interface, offering convenient usability and timely, comprehensive information presentation.
The host computer of the automated control and testing module adopts a nested, platform-based architecture, enabling rapid switching among multiple test types.
It can support automated storage of data in multiple formats.

Solution Advantages

Strong system compatibility

It supports sorting and testing across a wide range of product package types, size specifications, test methodologies, and test instrument configurations.

Integrated air interface technology

The system test environment meets the air‑interface testing requirements for millimeter‑wave antennas. It supports measurements of position calibration, transmit and receive power, flatness, beamforming, EVM, ACPR, isolation, noise figure, and more.

Extensive industry experience

The company has been engaged in RF and microwave testing technologies for nearly two decades. In the field of millimeter-wave testing, it has developed the capability to design and manufacture test products up to 170 GHz, and maintains long-term, close collaborations with relevant universities, research institutes, and manufacturing facilities.

Order Information

Project Name	Model number	Description
Translational sorting test equipment	ST5203	Sorting test, Workstation 2/4, UPH = 1,800 pcs, receives components in bulk or on trays, highly versatile.
Signal extraction fixture	AFX300	RF signal extraction, with TRL calibration, frequency range: DC to 50 GHz
High-speed switching unit	Customization	Instrument channel expansion, switching speed: ≤10 ns, frequency: 10 MHz to 67 GHz
loadboard	Customization	Chip test power supply control, signal switching, electrical signal measurement, and more.